Similar to its predecessors, the MediaTek Dimensity 9500 maintains its competitiveness and occasionally even surpasses Qualcomm’s Snapdragon 8 Elite Gen 5. At least if the Xiaomi 17 Pro Max and Vivo X300 Pro’s recent benchmarks are any indication.
Earlier this week, Vivo introduced the Vivo X300 series, the company’s first phones to use MediaTek‘s top Dimensity 9500 processor. Early benchmarks of the SoC on MediaTek’s test device revealed a modest inferiority to Qualcomm’s, but more recent ones suggest the situation is more nuanced.
Vivo X300 Pro vs Xiaomi 17 Pro Max AnTuTu benchmark
The Vivo X300 Pro and the Snapdragon 8 Elite Gen 5-powered Xiaomi 17 Pro Max have now been tested side by side under nearly comparable settings, and their AnTuTu benchmark results have appeared online. Unexpectedly, the Vivo gadget outperforms the Xiaomi, scoring 3,956,885 overall compared to 3,731,077 for the Xiaomi. In actuality, the latter score is higher than what that phone achieves on the current AnTuTu list.
Though not significantly, the Vivo X300 Pro also performed better on the CPU, GPU, and memory tests. Additionally, even though the Vivo’s battery is much smaller, both phones’ battery life decreased by 5%. But the Xiaomi 17 Pro Max remained colder.
The 2025 Snapdragon Summit is scheduled by Qualcomm for September 23–26, 2025. The US-based chipmaker is probably going to reveal the Snapdragon 8 Elite 2, which will power the premium phones of the future. According to a recent Weibo post by trustworthy tipster Digital Chat Station, this next SoC will have significant improvements in processing and graphics capabilities.
According to the leak, Qualcomm’s second-generation Oryon CPU architecture would be available in the Snapdragon 8 Elite 2. According to reports, the chipset is aiming for single-core test scores of over 4,000 points and multi-core scores of up to 11,000 points on Geekbench 6. The new chip promises a considerable performance boost over the first-generation Snapdragon 8 Elite, which scored about 3,100 and 9,800, respectively.
Snapdragon 8 Elite 2: big upgrade in CPU and GPU performance
A 16MB GMEM cache and an updated Adreno 840 GPU are also anticipated to be included in the platform, which will enable it to easily handle demanding visuals and graphics-intensive applications. These improvements imply that future flagship smartphones will prioritize improved thermal management and performance efficiency.
Snapdragon 8 Elite 2 known specs
According to rumors, the Snapdragon 8 Elite 2 will offer notable upgrades over its predecessor with a 2+6 CPU structure and a potential clock speed of up to 5GHz. With a base frequency of 4.4GHz, which is marginally higher than the 4.32GHz of the previous iteration, the CPU is anticipated to be constructed using TSMC’s third-generation 3nm process.
Xiaomi is probably going to be the first company to release phones with this chipset, specifically the Xiaomi 16 and Xiaomi 16 Pro, based on past trends. The OnePlus 15, iQOO 15, 15 Pro, Honor Magic 8 series, Realme GT 8 Pro, Nubia Red Magic 11 series, and Redmi K90 series are possible more early adopters.
The new processor is anticipated to be included in the Vivo X300 Ultra and Oppo Find X9 Ultra, which are scheduled to launch next year. It’s unclear, meanwhile, if the Xiaomi 16 Ultra will use the company’s proprietary Xring SoC or the Snapdragon processor.
The flagship chipset, the Dimensity 9400+, was revealed in April as the replacement for the Dimensity 9400 from the previous year. It is constructed with TSMC’s state-of-the-art 3nm technology and has a powerful CPU and GPU that guarantee seamless operation even under demanding conditions.
To discover how the flagship-grade MediaTek Dimensity 9400+ chipset compares to its rivals, we’ll be examining its benchmark scores here.
Note: The Vivo X200s (powered by MediaTek Dimensity 9400+) underwent the following benchmark testing.
MediaTek Dimensity 9400+ AnTuTu score
The Dimensity 9400+ receives more than 2.9 million points overall on AnTuTu v10. According to the breakdown, the CPU receives 625K points, the GPU receives 1.3 million, the memory receives 509K, and the user interface receives 459K.
In contrast, the Oppo Find X8, which is powered by the Dimensity 9400, has an overall AnTuTu score of about 2.7 million. There isn’t much of a difference between the two AnTuTu scores for the more recent chip.
Dimensity 9400+
Dimensity 9400
AnTuTu score
2,907,358
2,754,825
CPU
625,811
622,149
GPU
1,312,632
1,220,751
Memory
509,570
489,110
UX
459,344
422,815
Dimensity 9400+ Geekbench score
The Dimensity 9400+ receives 2,945 single-core and 9,184 multi-core marks in Geekbench 6. Once more, the Dimensity 9400, which boasts 2,904 single-core and 8,812 multi-core scores, is not a much better processor.
Dimensity 9400+
Dimensity 9400
Single core
2,945
2,904
Multi core
9,184
8,812
MediaTek Dimensity 9400+
Compared to the Dimensity 9400, the Dimensity 9400+ isn’t much better. With the exception of a little boost in CPU speed for the big core, it still makes use of the same set of CPU cores—one Cortex-X925, three Cortex-X4, and four Cortex-A720. The manufacturing node (TSMC’s 4nm) and instruction set (ARMv9.2-A) remain unchanged.
The Mali-G9125 Immortalis MP12, which is based on ARM’s fifth-generation GPU architecture, offers no improvements at all. The MediaTek Frame Rate Converter tool has been improved, though not significantly. In well-known games, the updated version can provide twice the effective frame rate while also increasing power efficiency by up to 40%.
MediaTek would undoubtedly not miss out on the widespread use of agentic AI, as the Dimensity 9400+ offers a 20% quicker agentic AI performance than its predecessor with Speculative Decoding (SpD+). With on-device processing, the chip fully supports the DeepSeek-R1-Distill (1.5B/7B/8B) model.
With the exception of the newer Dimensity 9400+ chip, which increases phone-to-phone Bluetooth connections from 1.5km to 10km, connectivity isn’t getting any major changes. Everything else is the same, so it has a 3GPP Release-17 5G modem, Bluetooth 6.0, and Wi-Fi 7 (peak speed 7.3Gbps).
Dimensity 9400
Info
Announced
April 2025
Process node
3nm (TSMC)
CPU
1 x Cortex-X925 — 3.73GHz 3 x Cortex-X4 — 3.3GHz 4 x Cortex-A720 — 2.4GHz
GPU
Arm Immortalis-G925 MC12 MediaTek HyperEngine Gaming Ray tracing support
NPU
MediaTek NPU 890
Camera
MediaTek Imagiq 1090 ISP Up to 320MP single camera Up to 8K/60fp video recording Features: Gen-AI Telephoto, Full range HDR zoom, real-time AI segmentation in video
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According to reports, Google’s Pixel 10 series will use the Tensor G5 as its next processor. According to reports, it will be manufactured under the codename “Laguna” under a multi-year agreement with TSMC, which would completely replace Samsung. There have been major architectural modifications in this flagship processor.
According to reports, the Google Tensor G5 has an 8-core CPU and makes use of TSMC’s 3nm node. One Cortex-X4 prime core at 3.4 GHz, three to five Cortex-A725 performance cores at roughly 2.85 GHz, and two to four Cortex-A525 efficiency cores at 2.4 GHz are typical configurations, though reports vary significantly. Using the Cortex-A725, the design prioritizes efficiency and long-term performance, which is further improved by the 3nm technology. The goal of switching to more modern efficiency cores is to enhance the user experience in general.
A single-core score of roughly 1323 and a multi-core score of roughly 4004 are displayed in the leaked Geekbench 6 results. These are preliminary findings, but they fall short of the Tensor G4’s scores (about 1950 single-core and 4741 multi-core).
There is potential for improvement through software optimization, as indicated by projected scores of 2200 single-core and 5700 multi-core, as well as a company objective of maybe surpassing 2300 single-core and 7600+ multi-core. Early software optimization or certain test setups could be the cause of the initial lower scores. In early incarnations, the emphasis on a more efficient production process may put power efficiency ahead of peak performance.
Despite architectural modifications and the switch to a 3nm technology, early benchmarks indicate that the Tensor G5 might not much outperform its predecessor in Geekbench 6. The particular setups of the testing devices or early software optimization may be to blame for this. In early generations, the shift to a more efficient manufacturing process may put power efficiency ahead of peak performance benefits.
The Tensor G5 is anticipated to include a dual-core Imagination Technologies IMG DXT-48-1536 GPU clocked at 1.1 GHz, whereas the Google Tensor G4 used an Arm Mali-G715 MP7 GPU. This marks a substantial shift away from Google’s prior dependence on Arm Mali GPUs. This points to a change in strategy, either motivated by discontent with Mali’s performance in some domains or a keen interest in the capabilities of the IMG DXT.
The highest level in the Ray Tracing Level System (RTLS), Level 4 ray tracing, is supported by the IMG DXT GPU, allowing for powerful visuals with low power consumption. This attempts to give the Pixel 10 more lifelike and captivating visual and gaming experiences. Users that value visual quality and game performance will find Level 4 ray tracing’s cutting-edge visuals appealing.
Power efficiency is a key component of the IMG DXT, and its successor, the DXTP, offers up to 20% more power efficiency (FPS/W). Although DXT is used by the Tensor G5, this suggests a common pattern in Imagination’s designs. By switching to IMG DXT, the Pixel 10’s graphics subsystem may become more power efficient, which could solve a persistent problem with Tensor-based devices’ short battery life. A major benefit would be increased power efficiency over the Mali-G715 MP7.
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This week, the Xiaomi 15S Pro was launched in China. The Chinese OEM’s first phone to employ its proprietary 3nm 10-core XRING 01 chipset is this one. The phone comes with HyperOS 2.0, which is based on Android 15, and supports 16GB of LPDDR5X RAM in addition to up to 1TB of UFS 4.0 built-in storage. A 50-megapixel triple rear camera set with a 50-megapixel periscope telephoto shooter is included with the Xiaomi 15s Pro. With compatibility for both wired and wireless fast charging, it has a 6,100mAh battery.
The 16GB + 512GB RAM and storage version of the Xiaomi 15S Pro costs CNY 5,499 (about Rs. 65,500) in China, while the 16GB + 1TB model costs CNY 5,999 (approximately Rs. 71,500). The phone is available in Far Sky Blue and Dragon Scale Fibre Version finishes. The official e-store is now the place to buy the phone in the nation.
Xiaomi 15S Pro specs
The Xiaomi 15S Pro has a 6.73-inch 2K (3,100 x 1,440 pixel) OLED LTPO screen with a refresh rate of up to 120 Hz, a maximum brightness level of 3,200 nits, a PWM dimming rate of 1,920 Hz, and protection from Xiaomi’s Ceramic Glass 2.0. Dolby Vision and HDR10+ are also supported by the screen. The company’s latest 3nm 10-core XRING 01 chipset, which has an Immortalis-G925 GPU, 16GB of LPDDR5X RAM, and up to 1TB of UFS 4.0 onboard storage, powers the phone. Xiaomi’s HyperOS 2.0, which is based on Android 15, comes pre-installed.
The Xiaomi 15S Pro boasts a triple rear camera set with Leica backing, which includes a 50-megapixel, 1.31-inch Light Fusion 900 primary sensor with an f/1.44 aperture and support for optical image stabilization (OIS). A 50-megapixel Sony IMX858 periscope telephoto shooter with 5x optical zoom, 10x in-sensor lossless zoom, f/2.5 aperture, and OIS support is also included in the camera setup, along with a 50-megapixel Samsung S5KJN1 sensor and a 115-degree ultra-wide angle lens with an f/2.2 aperture and macro capabilities. Additionally, the smartphone has a 32-megapixel OV32B40 front camera with an f/2.0 aperture for video calls and selfies.
The 6,100mAh battery of the Xiaomi 15S Pro supports both 90W wired and 50W wireless fast charging. The phone incorporates an in-display fingerprint sensor for security. 5G, dual 4G VoLTE, Wi-Fi 7, Bluetooth 5.4, Beidou, Galileo, GLONASS, GPS, NavIC, NFC, and a USB Type-C 3.2 Gen 1 connector are among the connectivity possibilities. The phone’s construction is water and dust resistant, with an IP68 rating. Additionally, it features dual speakers that enable Dolby Atmos. The smartphone weighs 216g and has dimensions of 161.3×75.3×8.33mm.
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The in-house Exynos 2600 chipset is expected to be manufactured by Samsung, which is apparently nearing mass production readiness, according to a recent Korean article.
In terms of competition, Samsung Foundry has not yet reached the desired milestone, whereas TSMC has already exceeded 60% yield on their 2nm class N2 node. However, a recent report indicates that the nascent chip manufacturer is rather close, with yields currently falling between 4 and 50 percent. It is far higher than the predicted 30% figure that was released in February.
Samsung may be forced to forgo the Snapdragon 8 Elite 2 chip for the upcoming Galaxy S26 series in some areas next year due to the Exynos 2600 chipset’s promising results from the efficient 2nm technology.
The Snapdragon 8 Elite 2 for Galaxy will be developed using the same 2nm technology, the report also reveals. It is expected to appear in the second half of 2026, maybe alongside the Galaxy Z Fold 8 and Galaxy Z Flip 8.
According to a post published by a tipster on X, the Korean tech giant apparently had to sacrifice performance in order to obtain functional chips, meaning that SF2 will once again lag behind TSMC’s N2 node in terms of raw performance. There might be a significant performance difference between the standard Snapdragon 8 Elite 2 and the tipster’s claim if it turns out to be accurate.
The Helio G200, MediaTek’s newest chipset, was formally announced. It significantly improves the low-cost phone lineup, which is dominated by Xiaomi phones. Utilizing the advancements of its predecessor, the Helio G100, which powered the well-liked Redmi Note 14 Pro 4G, this new chip delivers significant improvements to networking and camera management.
The G200 is a component of MediaTek’s continuous effort to offer premium features at reasonable costs, which is exactly in line with Xiaomi’s own strategy in the smartphone market.
Better Performance
The MediaTek Helio G200 features the same core architecture as the previous one but with several significant upgrades:
Octa-core CPU setup (6x Arm Cortex-A55 at 2.0GHz + 2x Arm Cortex-A76 at 2.2GHz)
Mali-G57 MC2 GPU now at 1.1GHz for enhanced gaming performance
Support for LPDDR4X memory with speeds of up to 4266Mbps
Compatibility with UFS 2.2 storage for quick data access
MediaTek’s HyperEngine technology, which adjusts the network connections, display settings, and touch input while gaming, further strengthens the processor’s gaming capabilities.
Improved camera capabilities
One of the greatest advancements in the G200 is in its imaging abilities:
Support for camera sensors with as much as 200MP with 12-bit DCG
Triple ISP architecture for quicker image processing
Advanced AI noise reduction technology
Hardware-accelerated depth engine for enhanced portrait shots
Both single and dual camera bokeh effects are supported
Because of these enhancements, the G200 is a desirable option for smartphone manufacturers looking to offer exceptional photography capabilities in mid-range devices.
Features
The Helio G200 features several new connectivity features not available in the G100:
Optimized signal reception through DCSAR technology
MEDIATEK introduces new “Elevator Mode” for preserving connectivity in difficult situations
We should expect Xiaomi’s upcoming mid-range smartphones to employ this new G200 chip, as the Redmi Note 14 Pro 4G uses the Helio G100. Better gaming performance, better photography, and more reliable connectivity would all be supported by the updated specifications without significantly increasing the devices‘ price.
As noted by Mishaal Rahman on Twitter/X, Google appears to be working on updating the Linux kernel on all Tensor-powered Pixels. Specifically, the evidence presented suggests an update to version 6.1, which was released in December 2022 and is the second-to-newest version of the kernel, with 6.6 having been released in October 2023.
Release of new software updates on a regular basis is one of the biggest selling points of a Pixel device, and it appears that Tensor-powered Pixels are about to receive a rare software update that updates the kernel used in the background.
While there’s no word on what a kernel upgrade might change, this is notable for a couple of reasons.
One of the comments mentions that “some Pixel devices” will be released with version 5.15 on “Android V,” which is Android 15. That also suggests that the timeline at play here is not in the immediate future but rather sometime after Android 15’s release. The 5.10 kernel version will see its end-of-life date in December 2026, so it most likely will not be too long after. For starters, this update would put all Tensor-powered Pixels on the same kernel. Pixel 6 and forward all ran on version 5.10 until the launch of Pixel 8, with 8 and 8 Pro running version 5.15.
Updates to the kernel typically do not affect the user experience much, but they can have a significant impact on how your device functions. This includes performance and battery life. Custom kernels were a fairly common feature back when Android modding was more common.
As the October launch date draws nearer, more information about Qualcomm’s next-generation system-on-chip for smartphones and tablets is starting to emerge. A purported benchmark for the Snapdragon 8 Gen 3 has just surfaced, suggesting significant upgrades over the previous flagship chipset.
The alleged GeekBench 5 scores of the forthcoming Snapdragon 8 Gen 3 have reportedly been uploaded by a Chinese leaker and trustworthy source, Digital Talk Station. The silicon reached 1700 in the single-core category, and roughly 6600 in the multicore category, according the listing. With an average of 1500 and 5000, respectively, the new chip outperforms the Snapdragon 8 Gen 2 by 12 and 20%.
Qualcomm Snapdragon 8 Gen 3 vs. Apple A16 Bionic
If these results are replicated in the chipset’s production unit, the Snapdragon 8 Gen 3 will perform worse on single-core tests than Apple’s A16 Bionic (1800/5300), but far better on multi-core tests. The iPhone 14 Pro (review) and iPhone 14 Pro Max are now powered by the Apple A16 Bionic, whereas the iPhone 15 will be the first device to use the more effective A17 Bionic.
These scores are based on the upgraded configuration of the chipset, which has a 1+5+2 core cluster, according to another leak that Twitter user @tech reve reported. Although the five performance cores are now operating at two distinct frequencies, the main Cortex-X4 appears to have been turned down from 3.4 GHz to 3.2 GHz, increasing the multicore value.
It was previously believed that the Snapdragon 8 Gen 3 had a top clock speed of 3.7 GHz and a 50% boost in GPU performance. But, there hasn’t been any further information regarding this since. Perhaps Samsung will reserve and only use this version of the proprietary Processor, just like they did with the Snapdragon 8 Gen 2 for Galaxy.
The Snapdragon 8 Gen 3 may be unveiled during the upcoming Snapdragon Summit, which Qualcomm said will take place in October. In November, the first smartphones that utilize the platform are anticipated. At the aforementioned later date, Xiaomi is supposedly unveiling the Xiaomi 14 series.
Late last year, Qualcomm launched a new naming scheme for its chipsets, which it continued with the upper mid-range Snapdragon 7 Gen 1 earlier this year. The SD 4 Gen 1 and SD 6 Gen 1 are now being revealed by the US chip creator, who is going downstream.
The new chipsets, which take the place of the SD 400 and SD 600 naming conventions, also add a few useful features to their respective price ranges. What you need know about them is as follows:
Snapdragon 6 Gen 1
The 4nm Snapdragon 6 Gen 1 is undoubtedly the best chipset out of the bunch, with an octa-core CPU (4x Cortex-A78 and 4x Cortex-A55) with a claimed 40% performance improvement over the Snapdragon 695, which is, admittedly, a weaker chip. A 35%-better performing Adreno GPU is also included with the SoC, along with gaming-specific features like variable rate shading and jank minimization.
Qualcomm’s new SoC also brings an improved AI engine with a Hexagon Tensor Accelerator and a claimed 3x increase to AI performance, as well as a Snapdragon X62 5G modem.
Snapdragon 4 Gen 1
Snapdragon 6 Gen 1
CPU
2x Cortex-A78 6x Cortex-A55
4x Cortex-A78 4x Cortex-A55
GPU
Adreno
Adreno
Modem
Snapdragon X51 5G 2.9Gbps down
Snapdragon X62 5G 2.5Gbps down
Camera
108MP snapshot 32MP single 25MP+13MP dual 13MP triple
48MP single 25MP+16MP dual 13MP triple 108MP snapshot 4K HDR
Connectivity
Bluetooth 5.2 Wi-Fi 5
Bluetooth 5.2 Wi-Fi 6E
Manufacturing process
6nm
4nm
The Snapdragon 6 Gen 1 also offers a respectable selection of photographic features, including up to 200 MP for a single camera (likely for a snapshot), 25 MP and 16 MP for a dual camera, and 13 MP for a triple camera. Additionally, 4K HDR video recording is something you can anticipate, which is an upgrade over the Snapdragon 695’s complete lack of 4K video recording.
Other noteworthy features include 120Hz at FHD+ display resolutions, Bluetooth 5.2, Wi-Fi 6E, and support for Quick Charge 4+.
You’re in for a bit of a wait if you want a phone with this chipset, as Qualcomm says devices with the SD 6 Gen 1 are set to launch in Q1 2023. Motorola has also confirmed that it will offer a phone with the new SoC.
Snapdragon 4 Gen 1
Additionally, Qualcomm unveiled the 6nm SD 4 Gen 1, which replaces the SD 6 Gen 1. With a claimed 15% boost over the SD 480, the new lower mid-range SoC offers an octa-core CPU (2x Cortex-A78 and 6x Cortex-A55). The GPU reportedly experiences a 10% performance increase.
Otherwise, it appears that the SD 4 Gen 1 and the SD 695 have a lot in common. Similar camera features (including support for 108MP snapshots but no 4K video recording), 120Hz support at FHD+ resolutions, Quick Charge 4+ support, Bluetooth 5.2, and Wi-Fi 5 are all present. Additionally, the Snapdragon X51 5G modem can reach downlink rates of 2.5Gbps.
You won’t have to wait long to see the first phones with the SD 4 Gen 1, as Qualcomm confirmed that the first devices will land this quarter (Q3 2022). Vivo’s Iqoo brand has revealed that the Iqoo Z6 Lite will be one of the first globally available phones with the new chipset.
